It looks like you're using an Ad Blocker.
Please white-list or disable AboveTopSecret.com in your ad-blocking tool.
Thank you.
Some features of ATS will be disabled while you continue to use an ad-blocker.
A complex modulated structure of reactive elements that have the capability of considerably more heat than organic explosives while generating a working fluid or gas. The explosive and method of fabricating same involves a plurality of very thin, stacked, multilayer structures, each composed of reactive components, such as aluminum, separated from a less reactive element, such as copper oxide, by a separator material, such as carbon. The separator material not only separates the reactive materials, but it reacts therewith when detonated to generate higher temperatures. The various layers of material, thickness of 10 to 10,000 angstroms, can be deposited by magnetron sputter deposition. The explosive detonates and combusts a high velocity generating a gas, such as CO, and high temperatures.
In a thermite igniter/heat source comprising a container holding an internal igniter load, there is provided the improvement wherein the container consists essentially of consumable consolidated thermite having a low gas output upon combustion, whereby upon ignition, substantially all of the container and said load is consumed with low gas production.
Well, if you're military you can, if you've got a project that needs it.
Originally posted by Bedlam
Nano-particulate explosive is not thermite. It is a very energy-dense compact explosive. You can get it in both slurry and cast blocks.
Well, if you're military you can, if you've got a project that needs it.
Originally posted by pillock
Who else but the military / CIA could get hold of it & pull off the biggest false flag op ever created ?
Originally posted by Cassius666
Which company holds those patents? Were persons of interest involved with those companies beyond holding their stock?
Originally posted by ALF88
Originally posted by Cassius666
Which company holds those patents? Were persons of interest involved with those companies beyond holding their stock?
Lots of unanswered questions, but those patents could help solve the puzzle.
Originally posted by Cassius666
Maybe you need to change the spaces? Maybe it expierd? I dont know really. The patent holder seems to be a Daniel Makowiecki. Is he still? Who owns the patent now if anybody?
www.patentmaps.com...
www.directorypatent.com...
Took me 3 minutes, not even hooper. If you would be more interested in the truth, rather than "your camp" winning hooper, you could have looked it up yourself instead of doing some solid trolling. That goes for anybody who puts himself in a camp of course. Its the source for most of the bull$hit on this particular forum. Can you imagine Hawkins and Preskill treating each other like some people do on here? Maybe they can create an culture of mutual trolling and stalling in the scientific community in an effort to bring the advancement of mankind to a crawl.edit on 3-7-2012 by Cassius666 because: (no reason given)
Originally posted by Cassius666
Which company holds those patents? Were persons of interest involved with those companies beyond holding their stock?
The United States Government has rights in this invention pursuant to Contract No. W-7405-ENG-48 between the United States Department of Energy and the University of California for the operation of Lawrence Livermore National Laboratory.
Originally posted by Cassius666Does that mean the US goverment is the sole patent holder at the moment?
Originally posted by Cassius666
Sure www.directorypatent.com... must be in on the truther conspiracy :p .
Also here it is, just remove the dots.
patft.uspto.gov.../55057 99&RS=PN/5505799
patft.uspto.gov...
Seems you just have to remove the dots and spaces. I guess the OP should have run a copy paste through the search engine before telling us to digit the number he provided in the search engine. Lets just say you are both a bit of a putz.edit on 3-7-2012 by Cassius666 because: (no reason given)
Originally posted by Bedlam
reply to post by Cassius666
It's DOE. And LLNL. And Sandia. And LANL.
HInt hint hint hint. Wink wink nudge nudge.
/"For any particular thing, ask What is it in itself? What is its nature?" -- Marcus Aurelius, Meditations
Thus, there is a need in the art for an explosive which has the capability of producing heat and expanding gases capable of producing work, as in explosives and propellants using organic components, while having the energy producing capability of explosives using inorganic components.
The stability of inorganic materials from which the new type explosive consists make it attractive for use in severe environments such a space applications.
DEFINITION - Sputter deposition is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a "target," that is source, which then deposits onto a "substrate," such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction — order 1% — of the ejected particles are ionized) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.